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Title:
METHODS OF MANUFACTURING MESH-LIKE MICRO-PARTICLE-METAL LAMINATED SUBSTRATE AND TRANSPARENT ELECTRICALLY CONDUCTIVE SUBSTRATE
Document Type and Number:
Japanese Patent JP2008283100
Kind Code:
A
Abstract:

To provide a method of manufacturing a mesh-like micro-particle-metal laminated substrate excellent in transparency and in moire-proof nature, with which the mesh-like micro-particle-metal laminated substrate can be manufactured with good productivity, to provide a mesh-like micro-particle-metal laminated substrate, and to provide an electrically conductive transparent substrate using the same.

The method of manufacturing the mesh-like micro-particle-metal laminated substrate is to laminate a micro-particle metal layer on a substrate in a mesh-like manner by coating at least one surface of the substrate with a micro-particle-metal solution, wherein the substrate is heat-treated at 30 to 200C at least before coating with the micro-particle-metal solution for lamination. The mesh-like micro-particle-metal laminated substrate is manufactured with such a manufacturing method, and the electrically conductive transparent substrate uses such a mesh-like micro-particle-metal laminated substrate.


Inventors:
OHASHI JUNPEI
TANAKA SHOTARO
TAKADA HAGUMU
Application Number:
JP2007127638A
Publication Date:
November 20, 2008
Filing Date:
May 14, 2007
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
H05K9/00; B32B5/16; B32B15/08; H01B5/14; H01B13/00