Title:
マイクロデポジション装置
Document Type and Number:
Japanese Patent JP5145259
Kind Code:
B2
Abstract:
A microdeposition system ( 20 ) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head ( 50 ) includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition head relative to the substrate. A controller ( 22 ) includes a positioning module that communicates with the positioning device and that generates position control signals for the positioning device. A nozzle firing module communicates with the microdeposition head ( 50 ) and selectively generates nozzle firing commands to define features of at least one layer of an electrical device, such as resistors, traces and capacitors on a printed circuit board, polymer light emitting diodes, and light panels.
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Inventors:
Edwards, Chillards, Oh.
David, Albertari
Beerich, Howard Walter
James Middleton
Bruner, Scott Earl.
Gratosieve, oreg
David, Albertari
Beerich, Howard Walter
James Middleton
Bruner, Scott Earl.
Gratosieve, oreg
Application Number:
JP2009014785A
Publication Date:
February 13, 2013
Filing Date:
January 26, 2009
Export Citation:
Assignee:
ULVAC, Inc.
International Classes:
B05C5/00; B05D1/26; B05C9/12; B05C9/14; B05C11/00; B05C11/10; B05D3/00; B25B11/00; B29C67/00; B41J2/01; B41J2/04; B41J2/045; B41J2/05; B41J2/055; B41J3/407; B41J3/54; H01L21/00; H01L21/683; H01L23/12; H01L51/50; H05B33/10; H05K3/06; H05K3/12; H05K13/04; H05K1/02
Domestic Patent References:
| JP11138820A | ||||
| JP11320925A | ||||
| JP11157055A | ||||
| JP7323550A | ||||
| JP9001797A | ||||
| JP2000071437A | ||||
| JP5149769A | ||||
| JP55090806A | ||||
| JP2000146993A | ||||
| JP7101062A | ||||
| JP9174835A |
Attorney, Agent or Firm:
Takao Hamano
Teruichi Hirai
Teruichi Hirai