Title:
微細加工超音波変換器ならびに関連する装置および方法
Document Type and Number:
Japanese Patent JP6914379
Kind Code:
B2
Abstract:
An ultrasound device includes: ultrasonic transducer cavities; a membrane comprising a silicon layer that seals the ultrasonic transducer cavities; electrode regions configured to control vibration of the membrane; and a complementary metal-oxide-semiconductor (CMOS) substrate including integrated circuitry that is electrically coupled to the electrode regions. The ultrasonic transducer cavities are disposed between the membrane and the integrated circuitry along a vertical direction of the ultrasound device.
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Inventors:
Rossburg, Jonathan, M.
Ally, Susan, A.
Fife, Keith, Gee.
Sanchez, Nevada, Jay.
Ralston, Tyler, S.
Ally, Susan, A.
Fife, Keith, Gee.
Sanchez, Nevada, Jay.
Ralston, Tyler, S.
Application Number:
JP2020025390A
Publication Date:
August 04, 2021
Filing Date:
February 18, 2020
Export Citation:
Assignee:
Butterfly Network, Incorporated
International Classes:
H01L21/02; B81C3/00; H04R19/00; H04R31/00
Domestic Patent References:
| JP2013018114A | ||||
| JP2012519958A | ||||
| JP2015109634A |
Foreign References:
| US20080296708 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito