Title:
MICRONEEDLE PATCH HAVING MULTILAYERED CONFIGURATION
Document Type and Number:
Japanese Patent JP2011167486
Kind Code:
A
Abstract:
To provide a microneedle patch which makes a microneedle to dissolve quickly within the skin while suppressing skin irritation and warping of a substrate of a microneedle array.
The microneedle patch is such that the back of the microneedle array is covered with a low moisture permeable layer and the back of the low moisture permeable layer is further covered with an adhesive protection tape having moisture permeability.
Inventors:
GON EISHUKU
KAMIYAMA FUMIO
KAMIYAMA FUMIO
Application Number:
JP2010053712A
Publication Date:
September 01, 2011
Filing Date:
February 22, 2010
Export Citation:
Assignee:
KOSUMEDEI SEIYAKU KK
International Classes:
A61M37/00
Domestic Patent References:
| JPH1029934A | 1998-02-03 |
Foreign References:
| US20090182306A1 | 2009-07-16 |
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