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Title:
INK MIXTURE AND METHOD FOR PRODUCING THE SAME, AND METHOD FOR SINTERING INK MIXTURE
Document Type and Number:
Japanese Patent JP2022071739
Kind Code:
A
Abstract:
To provide an ink mixture that suppresses the oxidation of copper and allows low-temperature sintering, so that it can be suitably used as a conductive copper ink material and a method for producing the ink mixture.SOLUTION: An ink mixture contains copper fine particles, and a nickel formate complex that has a ligand having an amino group.SELECTED DRAWING: None

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Inventors:
KAWASAKI HIDEYA
TOMORI DAIASUKE
Application Number:
JP2020180857A
Publication Date:
May 16, 2022
Filing Date:
October 28, 2020
Export Citation:
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Assignee:
UNIV KANSAI
International Classes:
C09D11/52; H01B1/22; H01B13/00
Attorney, Agent or Firm:
Patent Business Corporation Saegusa International Patent Office



 
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