Title:
MODIFIED CONJUGATED DIENE-BASED POLYMER, RESIN COMPOSITION CONTAINING THE SAME, AND (SEMI)CURED PRODUCT, ADHESIVE, RESIN FILM, BONDING FILM, PREPREG, LAMINATE, AND ELECTRONIC CIRCUIT BOARD MATERIAL
Document Type and Number:
Japanese Patent JP2023147193
Kind Code:
A
Abstract:
To provide a modified conjugated diene-based polymer which is excellent in adhesion to a metal foil, a semiconductor element and a support member for a semiconductor element and adhesion after moisture absorption, and is also excellent in low dielectric constant and low dielectric loss tangent, a resin composition containing the same, and a (semi)cured product, an adhesive, a resin film, a bonding film, a prepreg, a laminate, and an electronic circuit board material.SOLUTION: A modified conjugated diene-based polymer is a polymer having a part mainly containing a conjugated diene compound monomer, and has an acid value (mgCH3ONa/g) of 11.0 or more. The polymer is preferably a block copolymer, and more preferably has a polymer block (B) mainly containing a conjugated diene compound monomer and a polymer block (C) mainly containing a copolymer of a vinyl aromatic compound monomer and/or a conjugated diene compound monomer, or has 5-60 mass% of a polymer block (A) mainly containing a vinyl aromatic compound with respect to the total amount of the polymer.SELECTED DRAWING: None
Inventors:
SUKEGAWA TAKASHI
MATSUOKA YUTA
TAKEDA KEIJI
MATSUOKA YUTA
TAKEDA KEIJI
Application Number:
JP2023017499A
Publication Date:
October 12, 2023
Filing Date:
February 08, 2023
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
C08F293/00; B32B15/08; C08F8/04; C08J5/08; C08J5/18; C08L53/00; C09J11/06; C09J109/00; C09J153/02; C09J163/00; C09J201/00
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito