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Title:
MODIFIED SHEET CLAY MATERIAL AND EPOXY/CLAY NANO COMPOSITE MATERIAL CONTAINING THE SAME
Document Type and Number:
Japanese Patent JP2003055030
Kind Code:
A
Abstract:

To provide an epoxy/clay nano-composite material having excellent characteristics (high adhesion strength and low moisture absorption) suitable for a molded body of electronic appliances, a packaging material, an adhesive material or the like.

The epoxy/clay composite material containing a clay material uniformly dispersed in a nano-order scale in an epoxy resin matrix is obtained by heating and kneading (1) ZrOCl2 and (2) a sheet clay material modified by ion exchanging by using a silane surfactant with an epoxy oligomer and then polymerizing the kneaded material.


Inventors:
SAI SOEN
KANG HUNG-CHOU
GIN MEISHO
JO KOKUGEN
SHO SHOSEI
Application Number:
JP2001361237A
Publication Date:
February 26, 2003
Filing Date:
November 27, 2001
Export Citation:
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Assignee:
IND TECH RES INST
International Classes:
C04B33/13; C08K9/06; C08L63/00; C09C1/42; C09C3/12; (IPC1-7): C04B33/13; C08K9/06; C08L63/00; C09C1/42; C09C3/12
Attorney, Agent or Firm:
Sota Asahina (3 outside)