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Patent Searching and Data


Title:
MOLD AND METHOD FOR FORMING THROUGH HOLE
Document Type and Number:
Japanese Patent JP2004358895
Kind Code:
A
Abstract:

To provide a forming technique which enables elimination of a burr on the occasion of forming a through hole.

A gap is provided beforehand between the butting faces of the first and second mold members, allowing for a difference between the amount of thermal expansion of the first and second mold members and that of the rod-like core material at normal temperatures, in a state wherein the fore end face of a rod-like core material fitted to a first mold member is brought into contact with the bottom part of a molding material filling recess of a second mold member. In this constitution, the gap becomes zero due to the amount of thermal expansion at a raised temperature and thus the first and second butting faces are brought into contact with each other.


Inventors:
GOTO YASUHIRO
SAKAGAMI KEIJI
Application Number:
JP2003162274A
Publication Date:
December 24, 2004
Filing Date:
June 06, 2003
Export Citation:
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Assignee:
HITACHI IND EQUIPMENT SYS
International Classes:
B29C33/42; B29C45/26; (IPC1-7): B29C33/42; B29C45/26
Attorney, Agent or Firm:
Katsuo Ogawa
Kyosuke Tanaka