Title:
MOLD, PLANARIZATION DEVICE, PLANARIZATION METHOD, AND ARTICLE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2021061265
Kind Code:
A
Abstract:
To solve the problem in which, in the conventional planarization device, a complicated optical system was required to achieve both an illumination optical system that irradiates light used for photocuring and an imaging optical system of a high-speed, high-resolution camera for checking the contact state.SOLUTION: A mold used for a planarization device to cure a composition in a state where a flat unit of the mold is in contact with the composition on a substrate is provided with a contact detection sensor that detects that an object has come into contact with a surface provided with the flat unit. This makes it possible to easily check the contact state between the substrate and the mold without installing a camera to check the contact state.SELECTED DRAWING: Figure 5
Inventors:
IWATANI SATOSHI
Application Number:
JP2019182450A
Publication Date:
April 15, 2021
Filing Date:
October 02, 2019
Export Citation:
Assignee:
CANON KK
International Classes:
H01L21/027; B29C59/02; G01B7/00
Attorney, Agent or Firm:
Takuma Abe
Sogo Kuroiwa
Sogo Kuroiwa