Title:
MOLD RELEASE SHEET AND ADHESIVE MATERIAL
Document Type and Number:
Japanese Patent JP2010162900
Kind Code:
A
Abstract:
To provide a mold release sheet rarely giving an adverse influence on a hard disk device when used for the hard disk device, and to provide an adhesive material.
The mold release sheet includes a substrate and a mold release agent layer formed on the substrate, and is a mold release sheet stuck to the adhesive agent layer of an adhesive sheet for a hard disk device, wherein the mold release agent layer includes an olefin based thermoplastic elastomer having at least a density of 0.80-0.90 g/cm
COPYRIGHT: (C)2010,JPO&INPIT
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Inventors:
SAKURAI ISAO
SHIBANO TOMIKAZU
SHIBANO TOMIKAZU
Application Number:
JP2010060789A
Publication Date:
July 29, 2010
Filing Date:
March 17, 2010
Export Citation:
Assignee:
LINTEC CORP
International Classes:
B32B25/14; B32B27/00; B32B27/32; C09J7/00
Domestic Patent References:
JPH0699551A | 1994-04-12 | |||
JPH08215132A | 1996-08-27 | |||
JPS5745790B2 | 1982-09-29 | |||
JPH09235543A | 1997-09-09 | |||
JPH0464543A | 1992-02-28 |
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi
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