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Title:
MOLD RELEASE SHEET AND ADHESIVE MATERIAL
Document Type and Number:
Japanese Patent JP2010162900
Kind Code:
A
Abstract:

To provide a mold release sheet rarely giving an adverse influence on a hard disk device when used for the hard disk device, and to provide an adhesive material.

The mold release sheet includes a substrate and a mold release agent layer formed on the substrate, and is a mold release sheet stuck to the adhesive agent layer of an adhesive sheet for a hard disk device, wherein the mold release agent layer includes an olefin based thermoplastic elastomer having at least a density of 0.80-0.90 g/cm3and a polyethylene resin having a density of 0.902-0.925 g/cm3.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
SAKURAI ISAO
SHIBANO TOMIKAZU
Application Number:
JP2010060789A
Publication Date:
July 29, 2010
Filing Date:
March 17, 2010
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
B32B25/14; B32B27/00; B32B27/32; C09J7/00
Domestic Patent References:
JPH0699551A1994-04-12
JPH08215132A1996-08-27
JPS5745790B21982-09-29
JPH09235543A1997-09-09
JPH0464543A1992-02-28
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi