Title:
モールド型センサの製造方法及びモールド型センサ
Document Type and Number:
Japanese Patent JP6933499
Kind Code:
B2
Abstract:
To properly form a hole that becomes a passage between a sensitive part of a sensor and the outside, in a mold.SOLUTION: A pin 223 of a metal die for primary molding is inserted and fitted in a through-hole 11 of a substrate 1 and in a state where an end of the substrate 1 of a sensor unit 4 is held, injection molding is performed to obtain a first mold 5 which covers a portion of the sensor unit 4 excluding the end of the substrate 1. In a state where a pin 223 of a metal die for secondary molding is inserted and fitted in a communication hole 51 that is formed by the pin 223 of the metal die for primary molding of the first mold 5, around the first mold, injection molding is performed to obtain a second mold 6 which covers the end of the substrate 1 without covering a surface on which an opening of the communication hole 51 of the first mold 5 is positioned.SELECTED DRAWING: Figure 2
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Inventors:
Kusumi Takahiro
Yamada total
Yoshikoshi Hiroshi
Yamada total
Yoshikoshi Hiroshi
Application Number:
JP2017099351A
Publication Date:
September 08, 2021
Filing Date:
May 18, 2017
Export Citation:
Assignee:
Ono Sokki Co., Ltd.
International Classes:
H01L21/56; H04R1/02; H04R31/00
Domestic Patent References:
| JP2017075885A | ||||
| JP2010021225A |
Attorney, Agent or Firm:
Katsushi Sato