RESIN SEALING DEVICE - SUMITOMO HEAVY INDUSTRIES

Title:

RESIN SEALING DEVICE

Document Type and Number:

Japanese Patent JP2014117888

Kind Code:

A

Abstract:

To suppress the decrease in temperature during transportation of a substrate.

There is provided a resin sealing device 100 provided with a transport device 124 for transporting a substrate 102, wherein the transport device 124 is provided with a heat insulating plate 148 capable of suppressing radiation of heat from the substrate 102 in transporting the substrate 102. The heat insulating plate 148 is provided with a heat reflecting plate 150 having a function of reflecting heat radiated from the substrate 102 on a surface facing the substrate 102 of the heat insulating plate 148. Further, there is provided a preliminary heating part 114 for preliminarily heating the substrate 102 before carrying in molds 118 and 120 for resin sealing the substrate 102.

Inventors:

FUKUOKA MASARU
YAEGASHI TAKAAKI

Application Number:

JP2012275178A

Publication Date:

June 30, 2014

Filing Date:

December 17, 2012

Export Citation:

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Assignee:

SUMITOMO HEAVY INDUSTRIES

International Classes:

B29C45/02; B29C43/18; B29C43/32; B29C45/14; B29C45/26; B29L31/34; H01L21/56

Attorney, Agent or Firm:

Tsuyoshi Makino
Satoshi Takaya
Keisuke Matsuyama

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