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Title:
MOLDING MATERIAL FOR SEALING ELECTRONIC PART, ITS MOLDING, ELECTRONIC PART DEVICE AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JP11035647
Kind Code:
A
Abstract:

To obtain the subject molding material capable of manifesting the effect on the retardation of gelling and the improvement of preservation stability, etc., and having excellent moldability and reliability by compounding a vinyl ester resin with a specific initiator and an inhibitor.

The molding material consists essentially of (A) a vinyl ester resin, (B) a radical polymerization initiator (e.g. an aromatic peroxide), (C) a polymerization initiator containing at least one N-O bond in the structure (preferably an oxime-based compound, or nitroxide-based compound) and (D) an inorganic filter, and not less than 20 wt.% of the component A is a novolak- based vinyl ester resin. The amounts of the respective compounded ingredients are preferably 0.05-10 pts.wt. component B, 0.001-10 pts.wt. component C and 100-2,000 pts.wt. component D based on 100 pts.wt. component A. A transfer molding method and an injection molding method are desirable as the molding method of the molding material. As a result, high productivity of an electronic part device is expected by using the molding material.


Inventors:
Akimoto, Takayuki
Furusawa, Fumio
Hirakura, Hiroaki
Hirayama, Takao
Application Number:
JP1997000199911
Publication Date:
February 09, 1999
Filing Date:
July 25, 1997
Export Citation:
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Assignee:
HITACHI CHEM CO LTD
International Classes:
C08K3/00; C08F299/00; C08G59/17; C08L63/00; H01L23/29; H01L23/31; C08K3/00; C08F299/00; C08G59/00; C08L63/00; H01L23/28; (IPC1-7): C08F299/00; C08G59/17; C08K3/00; C08L63/00; H01L23/29; H01L23/31