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Patent Searching and Data


Title:
MOLDING RESIN COMPOSITION EXCELLENT IN LOW-TEMPERATURE BENDABILITY
Document Type and Number:
Japanese Patent JP2011148881
Kind Code:
A
Abstract:

To provide a molding resin composition which has adequate hardness while keeping the adhesiveness to polyvinyl chloride, and is excellent in flexibility (low-temperature bendability) at low temperature (-40°C), and whose components do not separate when the molding resin composition is melted for a long time, and which can be used suitably as a hot-melt material.

The molding resin composition contains aromatic polyester (a), a tackifier (b), a polyol compound (c) having two or more hydroxyl groups in one molecule thereof, and a core-shell particle (d). The core-shell particle (d) comprises a core comprising silicone-acrylic composite rubber and a shell comprising a vinyl compound having a polar group (x). The molding resin composition contains 1-50 parts mass core-shell particle (d) based on 100 parts mass aromatic polyester (a).


Inventors:
YAMAUCHI SHIGERU
Application Number:
JP2010010116A
Publication Date:
August 04, 2011
Filing Date:
January 20, 2010
Export Citation:
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Assignee:
YOKOHAMA RUBBER CO LTD
International Classes:
C08L67/00; C08L23/02; C08L51/04; C08L63/00; C08L69/00; C08L83/10; C08L93/04
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa