Title:
MOUNTING CIRCUIT BOARD AND BATTERY
Document Type and Number:
Japanese Patent JP2000114680
Kind Code:
A
Abstract:
To provide a slit which becomes a flux relief section when a lead plate is soldered to a pad electrode on the surface of the pad electrode.
The variation of the peeling strength of a lead plate 50 is reduced and the plate 50 is stably fixed by providing a slit 57 which becomes a flux relief section when the lead plate 50 is soldered to the pad electrode of a mounting substrate 51 on the surface of the pad electrode 55.
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Inventors:
NAKAMURA TAKESHI
Application Number:
JP27588398A
Publication Date:
April 21, 2000
Filing Date:
September 29, 1998
Export Citation:
Assignee:
SANYO ELECTRIC CO
International Classes:
H05K1/11; H01M2/10; H01M10/44; H05K1/14; (IPC1-7): H05K1/11; H01M2/10; H05K1/14
Attorney, Agent or Firm:
Koji Yasutomi (1 person outside)