Title:
多室型熱処理装置
Document Type and Number:
Japanese Patent JP7050062
Kind Code:
B2
Abstract:
This multi-chamber heat treatment device (S, S1, S2, S3) is provided with: intermediate conveyance devices (1, 3, 31, 6); and a plurality of processing devices (2A-2D, 4A-4H, 5, 7A-7D, 8, 9) that are mounted on the intermediate conveyance device, and that perform differing heat treatments on an workpiece (X). By moving the workpiece between the plurality of processing devices via the intermediate conveyance devices, prescribed heat treatments are performed on the workpiece.
Inventors:
Sakamoto Osamu
Nakamoto Ichiro
Takuma Yoshida
Nakamoto Ichiro
Takuma Yoshida
Application Number:
JP2019525390A
Publication Date:
April 07, 2022
Filing Date:
June 08, 2018
Export Citation:
Assignee:
Ihi Co., Ltd.
Ihi Mechanical Systems Co., Ltd.
Ihi Mechanical Systems Co., Ltd.
International Classes:
C21D1/00; C23C8/20; C21D1/06; F27B9/02; F27D13/00
Domestic Patent References:
| JP2011208838A | ||||
| JP2018044688A |
Foreign References:
| WO2016139983A1 |
Attorney, Agent or Firm:
Kazuzumi Nishizawa
Mitsuo Teramoto
Yuichiro Shimizu
Hisanori Takahashi
Mitsuo Teramoto
Yuichiro Shimizu
Hisanori Takahashi
Previous Patent: Wave energy converter buoy power extraction system
Next Patent: Gate structure and its manufacturing method
Next Patent: Gate structure and its manufacturing method