MULTI-COMPONENT REFRIGERATION CYCLE EQUIPMENT

Title:

MULTI-COMPONENT REFRIGERATION CYCLE EQUIPMENT

Document Type and Number:

Japanese Patent JP2022174869

Kind Code:

A

Abstract:

To provide a multi-component refrigeration cycle device capable of reducing an installation area of the device installed in a sub-fab and shortening piping for transferring a cooling medium to a semiconductor device manufacturing device.SOLUTION: A multi-component refrigeration cycle device 2 includes a first refrigerating cycle 5 in which a first refrigerant that exchanges heat with a cooling medium for cooling a semiconductor device manufacturing device 1 circulates, and a second refrigerating cycle 6 in which a second refrigerant that exchanges heat with the first refrigerant circulates. At least a part of the first refrigerating cycle 5 is arranged in a clean room in which the semiconductor device manufacturing device 1 is installed, and the second refrigerating cycle 6 is located inside a sub-fab.SELECTED DRAWING: Figure 1

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Inventors:

KOHIRO MOTOJI
FUKUZUMI YUKIHIRO
BANNAI NOBUTAKA
MIYATA HIROMASA

Application Number:

JP2021080878A

Publication Date:

November 25, 2022

Filing Date:

May 12, 2021

Export Citation:

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Assignee:

EBARA CORP
EBARA REFRIGERATION EQUIPMENT & SYSTEMS CO LTD

International Classes:

H01L21/50; F25B1/00; F25B7/00; H01L23/427

Attorney, Agent or Firm:

Tetsuya Hirosawa
Yutaro Watanabe

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