Title:
多層フレキシブル回路配線基板及びその製造方法
Document Type and Number:
Japanese Patent JP4233528
Kind Code:
B2
Inventors:
Fumihiko Matsuda
Application Number:
JP2005004845A
Publication Date:
March 04, 2009
Filing Date:
January 12, 2005
Export Citation:
Assignee:
Nippon Mektron Co., Ltd.
International Classes:
H05K3/46
Domestic Patent References:
| JP3246986A | ||||
| JP7176837A | ||||
| JP2004228322A |
Foreign References:
| WO2004093508A1 |
Attorney, Agent or Firm:
Akemi Kamata