Title:
MULTILAYER CERAMIC ELECTRONIC COMPONENT WITH HEAT-SHRINKABLE TUBE AND MOUNTING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2018148059
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component with heat-shrinkable tube ensuring highly reliable mounting easily, even when it is mounted manually.SOLUTION: A multilayer ceramic electronic component includes a multilayer ceramic capacitor 20 having a capacitor body 30, a first metal terminal 80a and a second metal terminal 80b, and a heat-shrinkable tube 100 attached to surround the multilayer ceramic capacitor 20 when viewing in the T direction. The heat-shrinkable tube 100 includes a pressing portion 110 for pressing a terminal joint 82 of the first metal terminal 80a against a first external electrode 70a, and pressing the terminal joint 82 of the second metal terminal 80b against a second external electrode 70b.SELECTED DRAWING: Figure 1
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Inventors:
SAKURAI YUSUKE
Application Number:
JP2017042346A
Publication Date:
September 20, 2018
Filing Date:
March 07, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/12; H01G2/06; H01G4/224; H01G4/232; H01G4/30; H01G13/00
Attorney, Agent or Firm:
Masahiro Okada
Ichi Ogiya
Ichi Ogiya