To provide a multilayer printed wiring board in which connection reliability does not deteriorate by forming a field via directly above a small diameter field via.

A field via 60 being formed on lid plating layers 36a and 36d is subjected to a larger stress during a heat cycle as compared with a field via 160 being formed in a second interlayer resin insulation layer 150. Consequently, the diameter d1 at the bottom of the field via 60 is made larger than the diameter d2 at the bottom of the field via hole 160 being formed directly above.