Title:
MULTILAYER WIRING BOARD, PRODUCTION THEREOF AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME
Document Type and Number:
Japanese Patent JP2960276
Kind Code:
B2
Abstract:
PURPOSE: To simplify production process of multilayer wiring board being employed in a multichip module.
CONSTITUTION: Planar conductor patterns 12, 13 for power supply and grounding are laminated alternately through a dielectric sheet to constitute a ceramic base board 11. Via hole contacts 15, 16 are arranged regularly and alternately in the center of the ceramic base board 11 while being connected electrically with internal planar conductor patterns for power supply and grounding. A multilayer thin film wiring part 22 comprising thin film wirings for power supply and grounding, connected selectively with respective via holes 15, 16, is provided on the main surface of the ceramic base board 11.
Inventors:
SUDO TOSHIO
ITO KENJI
ITO KENJI
Application Number:
JP8357393A
Publication Date:
October 06, 1999
Filing Date:
April 09, 1993
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
H01L23/12; H01L23/538; H05K3/46; (IPC1-7): H01L23/522; H01L23/12; H05K3/46
Domestic Patent References:
| JP2143587A | ||||
| JP341757A | ||||
| JP1164057A |
Attorney, Agent or Firm:
Takehiko Suzue
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