Title:
THERMOELECTRIC DEVICE
Document Type and Number:
Japanese Patent JPH0555639
Kind Code:
A
Abstract:
PURPOSE:To prevent an aging change due to the crack or the peeling of a semiconductor to be used for an electronic thermoelectric device and to suppress decreases in heat exchange capacity and efficiency due to a heat flow in a board. CONSTITUTION:A P-type semiconductor 12, a conductor 13, an N-type semiconductor 14 and a conductor 15 are formed on one side surface of an insulation film board 11. Corrugated fins 16 are disposed at the upper side of the board 11 in contact with the conductor 13. Corrugated fins 17 are arranged at the opposite side of the board 11 to the fins 16. The fins 17 are disposed under the conductor 15, and thermally connected through the film 11. The wedge- shaped P-type semiconductor 12, the conductor 14 and the conductors 13, 15 are laminated at the ends. With the structure, a heat flow flowing in the board is suppressed or shut OFF to improve heat exchange capacity and efficiency, and a thermoelectric device having a small aging change can be provided.
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Inventors:
YAMAMOTO YOSHIAKI
GYOTEN HISAAKI
NISHIWAKI FUMITOSHI
NAKAGIRI YASUSHI
GYOTEN HISAAKI
NISHIWAKI FUMITOSHI
NAKAGIRI YASUSHI
Application Number:
JP21065691A
Publication Date:
March 05, 1993
Filing Date:
August 22, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L35/32; (IPC1-7): H01L35/32
Attorney, Agent or Firm:
Akira Kobiji (2 outside)