Title:
【発明の名称】半導体素子の冷却装置
Document Type and Number:
Japanese Patent JP2518374
Kind Code:
B2
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Inventors:
HATOSAKI YOSHIHISA
Application Number:
JP1350389A
Publication Date:
July 24, 1996
Filing Date:
January 23, 1989
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L23/40; H01L25/11; (IPC1-7): H01L23/40
Domestic Patent References:
| JP58150844U |
Attorney, Agent or Firm:
Iwao Yamaguchi