Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2500669
Kind Code:
B2
Abstract:
PURPOSE: To provide a technique which prevents the dispersion of loading positions of semiconductor chips by a simple means in the manufacture of a semiconductor device to be formed by loading semiconductor chips on the loading surface for loading semiconductor chips by a solder material.
CONSTITUTION: After supplying a solder material on the loading surface 12 for loading semiconductor chips, a semiconductor material is sectioned by a marking-off means, a solder material 12a in a loading region nearly corresponding to a semiconductor chip is made to be separated by making it discontinuous to a solder material 12b of the other part so as to load the semiconductor chip by the separated solder material in order to eliminate the dispersion of loading positions of semiconductor chips to be caused in case of a larger solder material larger than a loading region.
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Inventors:
MAKIGUCHI SHIGEE
YAMAGUCHI NOZOMI
ITO MINORU
TSUBOI KUNIO
KAWAUCHI TAKETO
YAMAGUCHI NOZOMI
ITO MINORU
TSUBOI KUNIO
KAWAUCHI TAKETO
Application Number:
JP19148494A
Publication Date:
May 29, 1996
Filing Date:
August 15, 1994
Export Citation:
Assignee:
SONY CORP
International Classes:
H01L21/52; H01S5/00; (IPC1-7): H01L21/52
Attorney, Agent or Firm:
Toru Takatsuki