Title:
【発明の名称】ホウ素含有半導体層の形成方法
Document Type and Number:
Japanese Patent JP3057253
Kind Code:
B2
Inventors:
Takashi Noguchi
Kazuhiro Tajima
Kazuhiro Tajima
Application Number:
JP10519489A
Publication Date:
June 26, 2000
Filing Date:
April 25, 1989
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/265; H01L21/336; H01L29/78; H01L29/786; (IPC1-7): H01L21/265; H01L21/336; H01L29/786
Domestic Patent References:
| JP61187274A | ||||
| JP61105870A | ||||
| JP63261880A | ||||
| JP63237576A | ||||
| JP4991194A | ||||
| JP50122873A |
Attorney, Agent or Firm:
Masaru Tsuchiya