PURPOSE: To mount a semiconductor component accurately to a printed circuit board, in which a wide wiring pattern such as a power line and a narrow wiring pattern such as a signal line are mixed.

CONSTITUTION: When bumps 2a, 2b formed to the electrodes of a semiconductor chip 1 are abutted against corresponding wiring patterns 3a, 3b composed of conductive ink printed on a printed circuit board 4 and the semiconductor chip 1 is connected electrically to the printed circuit board 4, the wiring pattern 3a having board line width in the wiring patterns 3a, 3b on the printed circuit board 4 side is formed by printing narrow wiring patterns 3a1, 3a2 consisting of conductive ink in parallel at an interval A2 of a limiting minimum interval or less capable of separating lines by printing.