Title:
【考案の名称】副流路付カプラ構造
Document Type and Number:
Japanese Patent JPH0620979
Kind Code:
U
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Inventors:
Mount Yamamoto
Application Number:
JP40097790U
Publication Date:
March 18, 1994
Filing Date:
December 19, 1990
Export Citation:
Assignee:
富士通株式会社
International Classes:
F16L37/32; F16L39/00; (IPC1-7): F16L37/32; F16L39/00
Attorney, Agent or Firm:
Aoki Akira (4 outside)
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