Title:
NEW METALLOCENE COMPOUND AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JPH07291985
Kind Code:
A
Abstract:
PURPOSE: To obtain a new metallocene compound useful for polymerization of olefin and provide a method for producing the compound.
CONSTITUTION: This metallocene compound is represented by the formula R"x (FIRn)(CpRm)MeQk [F1 is fluorenyl group; Cp is a cyclopentadienyl or the like; each R is a halide or an organic group; R" is a structural bridge connecting (FIRn) and (CpRm); Me is a metal of IVB, VB and VIB of the periodic table; each Q is a hydrocarbon group or the like; (x) is 1 or 0; (k) is a number satisfying residual atomic valence of Me; (n) is 2-7; (m) is 0-7; further, in (FIRn), two adjacent positions are substituted by four connected carbons to form at least one benzo substituent].
Inventors:
ROORANDO ZENKU
HERUMUUTO JII ARUTO
EMU BURUUSU UERUCHI
HERUMUUTO JII ARUTO
EMU BURUUSU UERUCHI
Application Number:
JP5936795A
Publication Date:
November 07, 1995
Filing Date:
March 17, 1995
Export Citation:
Assignee:
PHILLIPS PETROLEUM CO
International Classes:
C07C13/567; B01J31/22; C07C22/04; C07C49/747; C07C51/31; C07C51/373; C07C51/377; C07C63/331; C07C63/49; C07C65/36; C07F7/00; C07F7/08; C07F17/00; C08F4/64; C08F4/642; C08F4/6592; C08F10/00; C08F110/06; C08F210/16; C08F4/639; C08F4/6392; C08F4/659; C08F110/02; (IPC1-7): C07F17/00
Attorney, Agent or Firm:
Akira Asamura (3 outside)
Previous Patent: power supply station
Next Patent: Polishing pad and method for manufacturing semiconductor device using the same
Next Patent: Polishing pad and method for manufacturing semiconductor device using the same