Title:
NON-HARDENABLE REFRACTORY PUTTY COMPOSITION
Document Type and Number:
Japanese Patent JP2014095068
Kind Code:
A
Abstract:
To provide a non-hardenable refractory putty composition having excellent lightness, workability and fire resistance.
A non-hardenable refractory putty composition contains a filler, a binder resin, a hollow inorganic filler and a resin-made microballoon. The filler is selected from aluminum hydroxide, magnesium hydroxide, talc and fly ash. The binder resin is selected from polybutene oil, liquid polybutadiene, liquid styrene-butadiene rubber, liquid chloroprene rubber and liquid isoprene rubber. The surface of the resin-made microballoon is coated at least partially with an inorganic powder, and the resin constituting the outer shell of the resin-made microballoon is selected from acrylonitrile resin, phenol resins and vinylidene chloride.
Inventors:
MITSUMUNE SHOTA
MIKI EIJI
OBA HIROHIKO
WADA TAKUYA
MOCHIGASE HIDENOBU
SUZUKI YUTAKA
MIKI EIJI
OBA HIROHIKO
WADA TAKUYA
MOCHIGASE HIDENOBU
SUZUKI YUTAKA
Application Number:
JP2013190825A
Publication Date:
May 22, 2014
Filing Date:
September 13, 2013
Export Citation:
Assignee:
FURUKAWA TECHNO MAT CO LTD
FURUKAWA ELECTRIC CO LTD
FURUKAWA ELECTRIC CO LTD
International Classes:
C09D201/00; C08K3/00; C08K5/00; C08K7/22; C08L101/00; C09D5/18; C09D5/34; C09D7/12; C09D109/00; C09D109/08; C09D109/10; C09D111/00; C09D123/20; C09D125/10
Domestic Patent References:
| JP2000212481A | 2000-08-02 | |||
| JP2001064481A | 2001-03-13 | |||
| JP2010522261A | 2010-07-01 | |||
| JP2011046821A | 2011-03-10 | |||
| JP2011173978A | 2011-09-08 |
Attorney, Agent or Firm:
Seiichi Inoue
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