Title:
非解放型サーモパイル赤外線センサ及びその製造方法
Document Type and Number:
Japanese Patent JP6982414
Kind Code:
B2
Abstract:
An unreleased thermopile IR sensor and method of fabrication is provided which includes a new thermally isolating material and an ultra-thin material based sensor which, in combination, provide excellent sensitivity without requiring a released membrane structure. The sensor is fabricated using a wafer transfer technique in which a substrate assembly comprising the substrate and new thermally isolating material is bonded to a carrier substrate assembly comprising a carrier substrate and the ultra-thin material, followed by removal of the carrier substrate. As such, temperature restrictions of the various materials are overcome.
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Inventors:
Klopernikki, Piotr
Marinesc, Raduem.
Humanic, Grigory.
Carago Ezoglu, Hermann
Chuang, Kairyan
Marinesc, Raduem.
Humanic, Grigory.
Carago Ezoglu, Hermann
Chuang, Kairyan
Application Number:
JP2017121290A
Publication Date:
December 17, 2021
Filing Date:
June 21, 2017
Export Citation:
Assignee:
Excelitas Technologies Singapore Private Limited
International Classes:
G01J1/02; H01L35/14; H01L35/16; H01L35/18; H01L35/22; H01L35/32
Domestic Patent References:
| JP2014193804A | ||||
| JP2003520447A |
Foreign References:
| US20130069194 | ||||
| WO2011145295A1 | ||||
| WO2010147532A1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
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