NONWOVEN FABRIC FOR CIRCUIT BOARD, PREPREG FOR CIRCUIT BOARD USING THE SAME, AND CIRCUIT BOARD USING THE SAME

Japanese Patent JP2022162270

A

To provide a nonwoven fabric for circuit boards with improved smoothness, suppressed high prices, and thinner thickness.SOLUTION: A nonwoven fabric for a circuit board is composed of a paper-making structure containing multiple thick fibers in which the thickest part of the fiber diameter is 5 μm or more and multiple fine fibers in which the thickest part of the fiber diameter is less than 5 μm. The average fiber length of the thick fibers is longer than that of the fine fibers and the number of the fine fibers is greater than the number of the thick fibers. The thick fibers have a flat shape having a long axis and a short axis, and the short axis is oriented in the thickness direction of the paper-making structure.SELECTED DRAWING: Figure 4

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NISHIMORI YUHEI
UEDA MASAHIKO

JP2021067010A

October 24, 2022

April 12, 2021

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NIPPON KODOSHI CORP
DUPONT SAFETY & CONSTRUCTION INC

D21H15/02; D21H13/26; D21H27/00; H05K1/03

Shinichiro Tanaka
Yoshi Kazuhiko Ta
Hiroyuki Suda
Kazuo Yamazaki
Satsuki Ichikawa
Hironobu Hattori
Gen Tashiro

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