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Title:
NOVEL SILICON-CONTAINING POLYMER COMPOUND AND ITS REPARATION
Document Type and Number:
Japanese Patent JP3496862
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a novel polymer compound usable as a conductive polymeric material having mechanical strengths and small ambient dependency as well as excellent conductivity by selecting a polymer compound comprising alternatingly arranged oligooxyalkylene chains and oligosiloxane chains.
SOLUTION: An oligooxyalkylene compound and an oligosiloxane compound are subjected to a polycondensation or polyaddition reaction to obtain a silicon- containing polymer compound comprising alternatingly arranged oligooxyalkylene chains and oligosiloxane chains and represented by formula I or II (wherein R1 to Rp are each a 1-5 C alkyl, an aryl or an aralkyl; S1 to Sp and T1 to Tp are each H, hydroxyl, a 1-7 C alkoxyl, phenoxy, a 1-10 C alkyl, an aryl or an aralkyl; x1 to xp are each 1-50; y1 to yp are each 1-10; and k1 to kp are each 1-100). By intermolecularly and chemically bonding the substituents S1 to Sp and T1 to Tp of the polymer compounds of formula I or II, a three-dimensional crosslinked polymer compound can be obtained.


Inventors:
Masao Kato
Yukio Nagasaki
Fumiaki Matsukura
Masayoshi Watanabe
Atsushi Nishimoto
Takashi Tokuda
Hidetoshi Aoki
Application Number:
JP15973897A
Publication Date:
February 16, 2004
Filing Date:
June 17, 1997
Export Citation:
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Assignee:
Hokushin Industry Co., Ltd.
International Classes:
G03F7/075; C08G77/26; C08G77/46; C08G81/00; (IPC1-7): C08G77/46; C08G77/26; C08G81/00; G03F7/075
Domestic Patent References:
JP62280842A
Attorney, Agent or Firm:
Hiroyuki Kurihara