To provide a nozzle for local solderings which prevents the occurrence of any solder bridge.

The nozzle for local solderings has its main body 3 provided in a main body 2 of a fused-solder vessel 1, a pump provided in the inside of the fused-solder vessel 1 and for feeding a fused solder to the inside of its main body 3, main bodies 5 of a plurality of cylinder apparatuses 4 attached to its main body 3 which are made of a heat resistant material, each piston 6 attached movably to each main body 5 and made of a heat resistant material, each rod 7 attached to each piston 6, wires 8 attached to the respective rods 7 which are made of copper plated by using chrome, and each electromagnetic valve 9 so provided between the fused-solder vessel 1 and each cylinder apparatus 4 as to connect the upper portion of the fused-solder vessel 1 with the lower portion of each main body 5.