Title:
ONE-PACK MOISTURE-CURABLE FLEXIBLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3892270
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a one-pack moisture-curable composition capable of improving storage stability without deteriorating curability for mutually conflicting performances such as the storage stability and curability, curable at normal temperature and having flexibility after curing.
SOLUTION: This one-pack moisture-curable composition is obtained by compounding a silyl compound having a hydrolyzable silyl group with a curing catalyst for the hydrolyzable silyl group, an epoxy resin and a ketimine compound prepared by reacting a carbonyl compound represented by chemical formula (2) (wherein, R4 and R5 are any one alkyl group selected from the group consisting of 2-6C alkyl groups and may be the same or different) with an amine compound having primary amino group and represented by chemical formula (3) (wherein, R6 is a residue except the primary amino group of the amine compound; and n is an integer of ≥1).
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Inventors:
Kentaro Suzuki
Nobuaki Matsuura
Hisaichi Horii
Nobuaki Matsuura
Hisaichi Horii
Application Number:
JP2001319709A
Publication Date:
March 14, 2007
Filing Date:
October 17, 2001
Export Citation:
Assignee:
Konishi Co., Ltd.
International Classes:
C08G59/40; C09K3/10; C08G59/56; C09D133/00; C09D163/00; C09D171/00; C09D183/04; C09J133/00; C09J163/00; C09J171/00; C09J183/04; (IPC1-7): C08G59/56; C09D133/00; C09D163/00; C09D171/00; C09D183/04; C09J133/00; C09J163/00; C09J171/00; C09J183/04; C09K3/10
Domestic Patent References:
| JP7242737A | ||||
| JP7188634A | ||||
| JP5311141A | ||||
| JP4001220A | ||||
| JP3263421A |
Attorney, Agent or Firm:
Kenji Yokoi