Title:
OPTICAL SEMICONDUCTOR ELEMENT MODULE
Document Type and Number:
Japanese Patent JP3893356
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that, in the integration of a recent optical semiconductor element module and an increase in a heating quantity in the module in association with a low power consumption, an improvement in a cooling efficiency is indispensable condition in the optical semiconductor element module needing a temperature control of the element.
SOLUTION: The optical semiconductor element module comprises: the optical semiconductor element 7; a base 7 which installs the element 7; a lens holding component 2 connected to the base 4 for holding a lens for condensing or collimating the light emitted from the element 7; and a container 1 for housing the element 7 and the base 4. In this module, the base 4 is made of a material which contains tungsten and copper as main components. The component 2 is different from the material of the base 4, and is made of the material having substantially the same linear expansion coefficient as that of the base 4.
Inventors:
Masato Negishi
Application Number:
JP2003087495A
Publication Date:
March 14, 2007
Filing Date:
February 16, 1996
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
G02B6/42; H01S5/022; H01L31/02; (IPC1-7): H01S5/022; G02B6/42; H01L31/02
Domestic Patent References:
| JP463669U | ||||
| JP429387A | ||||
| JP577964U |
Attorney, Agent or Firm:
Mamoru Takada
Hideki Takahashi
Atsuko Oaku
Tamaki Otsuka
Hideki Takahashi
Atsuko Oaku
Tamaki Otsuka
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