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Title:
有機組成物
Document Type and Number:
Japanese Patent JP2005516382
Kind Code:
A
Abstract:
The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula 11 as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly (2-vinyl naphthalene), vinyl anthracene, 1s polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.

Inventors:
Lee, Chang En
Zelebin, Ruthlan
Suleiman, Nasrin
Gebre Brun, Amawell
Anna Manna
Psychonia, John Gee
Rho, Chrysler
Apen, Paul Gee
Korolevu, Boris
Iwamoto, Nancy
Application Number:
JP2003560974A
Publication Date:
June 02, 2005
Filing Date:
January 14, 2003
Export Citation:
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Assignee:
Honeywell International Inc.
International Classes:
C08L25/00; C08F32/08; C08G61/02; C08L45/00; C08L65/00; H01L21/312; H01L21/316; (IPC1-7): H01L21/312; C08F32/08; C08G61/02; C08L25/00; C08L45/00; C08L65/00
Domestic Patent References:
JP2002284997A2002-10-03
JP2001294623A2001-10-23
JP2000340557A2000-12-08
JP2003131001A2003-05-08
JP2003141956A2003-05-16
JP2005529983A2005-10-06
Foreign References:
WO2001078110A22001-10-18
Attorney, Agent or Firm:
Kazuo Shamoto
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Okimoto Kazuaki