Title:
有機シロキサン組成物
Document Type and Number:
Japanese Patent JP5612821
Kind Code:
B2
Abstract:
A hot melt sealant/adhesive composition is provided which comprises the following components—Component A. a siloxane polymer composition comprising a) An organopolysiloxane which may comprise not less than two groups selected from i) silicon bonded alkenyl groups or ii) silicon-bonded hydroxyl groups and/or silicon bonded hydrolysable groups b) one or more fillers; and a cure system comprising c) a suitable catalyst and where required d) a suitable cross-linker adapted to react with component (a), catalysed with component (c); and either or both of components B. and C. wherein: —B. is one or more hot melt resins; and C. is one or more waxes having a melt temperature of between 40 and 200° C.; and/or an organic resin having a viscosity average molecular weight of from 200 to 6000 and a softening point of from 0° C. and 150° C.; wherein the total amount of components B and/or C in the composition is from 2 to 60% by weight of the whole composition.
Inventors:
ヨーゼフ、エドゥアール
ヴァンデルエーケン、パトリック
コンティ、ジュゼッピーナ
ボニー、ロバート
ヴァンデルエーケン、パトリック
コンティ、ジュゼッピーナ
ボニー、ロバート
Application Number:
JP2008521919A
Publication Date:
October 22, 2014
Filing Date:
July 04, 2006
Export Citation:
Assignee:
ダウ コーニング コーポレーションＤＯＷ ＣＯＲＮＩＮＧ ＣＯＲＰＯＲＡＴＩＯＮ
International Classes:
C09K3/10; C09D183/04; C09J11/04; C09J11/06; C09J183/06; C09J183/07; C09J191/06
Attorney, Agent or Firm:
Michiharu Soga
Hidetoshi Furukawa
Suzuki Ken 7
Jun Kajinami
Kazuhiro Oya
Hidetoshi Furukawa
Suzuki Ken 7
Jun Kajinami
Kazuhiro Oya