To provide a surface-treating agent providing adhesiveness at a low heat-treating temperature, and having high heat resistance.
The compound is represented by formula (1) (wherein, R1 is hydrogen, alkyl or substituted silicon group; X is an amide bond, an imide ring bond, an imino bond, a urea bond, a urethane bond, an ether bond, a thioester bond, an ester bond or a carbonate bond; L is a single bond or an arbitrary divalent linking group; X may form a ring with a benzene ring and two bonds; R2 and R3 are each a substituent; n is an integer of ≥0 and ≤3; and n1 is an integer of ≥1 and ≤4). The liquid composition and the resin composition contain the compound and a solvent. The adhesive and the coating agent contain the composition. The metal foil clad film and the metal foil laminate comprises the composition and the metal foil.
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NAKAI YOSHIHIRO
UCHIDA OSAMU
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda
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