PACKAGE FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT DEVICE

Title:

PACKAGE FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT DEVICE

Document Type and Number:

Japanese Patent JP2011142229

Kind Code:

A

Abstract:

To provide a package for electronic component that can be manufactured at low cost, along with an electronic component device, and a method of manufacturing the electronic component device.

The package for electronic component includes a leadframe connected to a plate-like electronic component and a shield plate which has an electromagnetic shield structure and arranged on one surface side of the electronic component. The shield plate is held by a lead of predetermined potential out of a plurality of leads included in the leadframe.

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Inventors:

TANAKA JUNJI

Application Number:

JP2010002308A

Publication Date:

July 21, 2011

Filing Date:

January 07, 2010

Export Citation:

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Assignee:

TOYOTA MOTOR CORP

International Classes:

H01L23/00; H01L23/08

Attorney, Agent or Firm:

Tadahiko Ito

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