Title:
PACKAGE STRUCTURE OF ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2748915
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make feasible of miniaturizing and light weighting of a structure fit for loading onto a spacecraft using neither a reinforcement frame nor a thick substrate by imposing tension upon a film circuit substrate fitted with electronic parts to be arranged later.
SOLUTION: An electronic equipment device 2 is fitted to a spacecraft structure 1 so that a thin film substrate 4 with electronic parts 3 fitted thereon may be contained in said device 2 while bending said substrate 4 using tension loaded bars us fulcrums. That is, the substrate 4 packaged with the parts 3, etc., are folded back into required shape while securing necessary bend radius not to break down the circuit using the tension loaded bars 5 to be fixed to the device 2. Through these procedures, the title structure can be miniaturized and light weighted so as to enable the device to be loaded onto the spacecraft structure 1 using neither a reinforcement frame nor a thick substrate.
Inventors:
ADACHI MASANORI
Application Number:
JP4849596A
Publication Date:
May 13, 1998
Filing Date:
March 06, 1996
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H05K1/18; H05K7/14; (IPC1-7): H05K7/14; H05K1/18
Domestic Patent References:
| JP3219221A | ||||
| JP62114245A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)