Title:
WIRE BONDING APPARATUS
Document Type and Number:
Japanese Patent JP2748918
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To connect all wires at the same loop height by blowing inert gas to a metal fine wire connected to an inner lead part and a bonding pad from the back surface side of a die pad part, and providing an adjustment plate for restricting the bent height of the warped metal fine wire.
SOLUTION: On a wire bonding apparatus there are provided inert gas supply system 1 for blowing inert gas to the next stage 7a to which there are sent semiconductor structures of a semiconductor pellet 11 to which a wire 15 is bonded and of an inner lead part of a lead frame 12 from the back surface side of the semiconductor pellet 11, and a wire adjustment plate 2 for restricting the height of the wire 15 blown with the inert gas and bent upward. The inert gas supply system 1 includes an air fan for supplying inert gas such as nitrogen supplied from the gas supply pipe 3. A blowoff hole of the fan has an opening of the size including the die pad part 13 and a gap between the die pad 13 and inner lead part 14.
Inventors:
KONNO HIDEKAZU
Application Number:
JP7608296A
Publication Date:
May 13, 1998
Filing Date:
March 29, 1996
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP57196536A | ||||
| JP236544A | ||||
| JP6249638A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
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