To provide a package that is highly airtight, and retains a characteristic impedance of 50 Ω without impairing power durability.
The package includes: a conductor baseplate; a metal wall disposed on the conductor baseplate; through holes formed at input/output portions of the metal wall; feedthrough lower layer portions disposed on the conductor baseplate; wiring patterns disposed on the feedthrough lower layer portions; feedthrough upper layer portions disposed on part of the feedthrough lower layer portions and on part of the wiring patterns; and terminals disposed on the wiring patterns. The feedthrough lower layer portions are partly larger than the through holes, and the feedthrough lower layer portions are in close contact with a metal wall side surface. The feedthrough upper layer portions are larger than the through holes, and the feedthrough upper layer portions are in close contact with the metal wall side surface. An air layer is formed between the wiring patterns and through hole inner walls.
| JPH0480101U | 1992-07-13 | |||
| JPH11238823A | 1999-08-31 | |||
| JPH0897320A | 1996-04-12 | |||
| JPH0480101U | 1992-07-13 |
Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
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