Title:
WLP法で製造可能なパッケージング電気部品およびその製造方法
Document Type and Number:
Japanese Patent JP2007526641
Kind Code:
A
Abstract:
An electrical component includes a substrate that includes one or more terminal contacts for one or more electrical component structures on a surface of the substrate. The electrical component also includes a cover having a first surface and a second surface. The cover includes one or more terminal pads on the first surface, one or more terminal contacts on the second surface, and electrical throughplatings electrically connecting the terminal pads and the contacts. The cover is on the surface of the substrate. The electrical component also includes a conductive adhesive is in one or more cavities between the substrate and the cover.
Inventors:
Wolfgang Pearl
Application Number:
JP2007501135A
Publication Date:
September 13, 2007
Filing Date:
January 14, 2005
Export Citation:
Assignee:
EPCOS AG
International Classes:
H01L23/12; H01L23/31; H01L23/498; H01L23/538; H05K3/40; H05K1/18; H05K3/00; H05K3/46
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel