To provide a packaging material for a photosensitive material free of cracking even when the photosensitive material comes in contact with the packaging material and capable of reducing the amount of metallic residue in incineration.

The packaging material has a light shielding layer 2 comprising a thermoplastic resin formed by polymerization with a metallocene catalyst, a moistureproof layer 6 having an inorganic material vapor-deposited on at least one face of a thermoplastic resin film 4 and stacked on the light shielding layer 2 by way of an adhesive 3, a protective layer 7 stacked on the moistureproof layer 6 so as to prevent the cracking of the vapor-deposited layer 5 of the inorganic material and an oxidation preventing layer 8 stacked on the protective layer 7.