Title:
PACKAGING MATERIAL
Document Type and Number:
Japanese Patent JP2003011285
Kind Code:
A
Abstract:
To provide a low cost packaging material, which can produce by a small lot and deliver in a short period of time.
This packaging material is produced by laminating a film 5 including a thin film layer 8, which is made of a synthetic resin excellent in heat resistance and peeling properties and having the thickness of below 10 μm, onto the surface 3a of a paper board 3 through an adhesive layer 4 made of a general purpose resin 4' such as polypropylene or the like.
Inventors:
CHIHAYA TADASHI
UCHIDA TAKEHIKO
UCHIDA TAKEHIKO
Application Number:
JP2001199618A
Publication Date:
January 15, 2003
Filing Date:
June 29, 2001
Export Citation:
Assignee:
NIPPO CORP
International Classes:
B65D65/40; B32B27/10; B32B27/32; (IPC1-7): B32B27/10; B32B27/32; B65D65/40
Attorney, Agent or Firm:
Hideo Fujimoto