PAD CONDITIONER AND MANUFACTURING METHOD FOR THE SAME

Title:

PAD CONDITIONER AND MANUFACTURING METHOD FOR THE SAME

Document Type and Number:

Japanese Patent JP3440064

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a pad conditioner that can not simply prevent dislodgment of a diamond abrasive grain but effectively prevent elution of a metal component of a bonding material and base metal when dressing an abrasive pad, and that protects the surface of a silicon wafer from a flaw and contamination even when the dressed abrasive pad is used.
SOLUTION: The pad conditioner 1 comprises base metal 20, a fixing plating layer 13 formed over the surface of the base metal 20, diamond abrasive grains 11 fixed over the surface of the base metal 20 by the fixing plating layer 13, and a multilayer resin film 14 formed on the surface of the fixing plating layer 13 so as to cover the surface thereof. The multilayer resin film 14 consists of three laminated resin layers 14a to 14c.

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Inventors:

Kazunori Kadomura
Kenji Fukushima
Hajime Asahino

Application Number:

JP2000273219A

Publication Date:

August 25, 2003

Filing Date:

September 08, 2000

Export Citation:

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Assignee:

Allied Material Co., Ltd.

International Classes:

B24B53/12; B24B53/017; B24D3/00; B24D3/06; B24D3/28; B24D7/02; H01L21/304; (IPC1-7): B24D7/02; B24B37/00; B24B53/12; B24D3/00; B24D3/06; B24D3/28; H01L21/304

Domestic Patent References:

JP200094324A
JP2000153463A
JP5261666A
JP457676A
JP60127973A
JP61169570U

Attorney, Agent or Firm:

Fukami Hisaro (3 outside)

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