Title:
パターンアレイ直接移転装置及びそのための方法
Document Type and Number:
Japanese Patent JP7086070
Kind Code:
B2
Abstract:
An apparatus includes a transfer element that is disposed adjacent the wafer tape. A tip end of the transfer element has a footprint sized so as to span across a group of dies on the wafer tape. An actuator is connected to the transfer element to move the transfer element to a die transfer position at which the transfer element presses on the wafer tape to press the group of dies into contact with a circuit trace on the product substrate.
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Inventors:
Cody Peterson
Andy Haska
Andy Haska
Application Number:
JP2019527530A
Publication Date:
June 17, 2022
Filing Date:
November 22, 2017
Export Citation:
Assignee:
Rohinni Limited Liability Company
International Classes:
H01L21/60; H01L21/50; H01L21/52
Domestic Patent References:
| JP2012156473A | ||||
| JP2003109979A |
Foreign References:
| US20160276205 | ||||
| US20040026938 |
Attorney, Agent or Firm:
Patent Business Corporation Tani / Abe Patent Office
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