Title:
フェノール樹脂系成形物及び積層板
Document Type and Number:
Japanese Patent JP4554092
Kind Code:
B2
Inventors:
Yutaka Hori
Application Number:
JP2001007253A
Publication Date:
September 29, 2010
Filing Date:
January 16, 2001
Export Citation:
Assignee:
Aica Kogyo Co., Ltd.
International Classes:
C08J5/00; B29C43/02; C08J5/04; C08L61/10; C08L71/02; B29K61/04; B29K105/06; B29L9/00
Domestic Patent References:
| JP58113244A | ||||
| JP55164215A | ||||
| JP55151019A | ||||
| JP55021415A |