PHOTOCURABLE COMPOSITION AND PRODUCTION OF MOLD MADE OF RESIN

Japanese Patent JP3657057

B2

PROBLEM TO BE SOLVED: To provide a resin composition suitable as a photocurable material, which can be used for forming a cured substance having high mechanical strength and excellent thermal resistance, and a production method for a mold made of a resin which enables production with ease of a resin mold having not only excellent dimensional accuracy, but also excellent durability for repeated use.
SOLUTION: This resin composition comprises a monomer component comprising 30 to 70wt.% of a multi-functional unsaturated monomer A having a cyclic structure and 70 to 30wt.% of a mono-functional unsaturated monomer B which has a cyclic structure and a homopolymer of which has a Tg of 70°C or higher; a photopolymerization initiator C; and an inorganic filler D having an average particle diameter or an average fiber length of 1 to 50μm. The inorganic filler is contained in an amount of 100 to 160 pts.wt. relative to 100 pts.wt. of the total amount of the monomer component and the photopolymerization initiator. A cured resin obtained from the composition has a distortion temperature of 100°C or higher. This production method for a mold made of a resin comprises subjecting the photopolymerizable resin composition to stereo lithography by means of a stereo LASER apparatus.

Takeshi Watanabe
Rei Matsumura
Yuichi Haruta
Takashi Ukachi

JP13702896A

June 08, 2005

May 30, 1996

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JSR CORPORATION
Nippon Special Coating Co., Ltd.

G03F7/004; B29C33/40; C08F2/48; C08F20/10; C08F290/00; C08F290/02; C08F299/00; G03F7/027; (IPC1-7): C08F2/48; B29C33/40; G03F7/004; G03F7/027

JP5279436A
JP8041147A
JP8059760A
JP8020620A
JP7228644A
JP9071707A
JP8183825A
JP8183823A
JP8183821A
JP8183820A

Masahiko Oi

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