PHOTOCURING RESIN COMPOSITION FOR SEALANT AND SEALING METHOD

Title:

PHOTOCURING RESIN COMPOSITION FOR SEALANT AND SEALING METHOD

Document Type and Number:

Japanese Patent JP2001139933

Kind Code:

A

Abstract:

To obtain a photocuring resin composition for sealant, capable of being cured at a low temperature, excellent in photosensitivity, rapidly curing properties and adhesion, giving high adhesive strength and resistance to moisture permeability to a cured product, giving good productivity, and capable of being suitably used for a flat panel display, such as a liquid crystal display and an electroluminescent display, to obtain a sealant containing the composition, and to provide a sealing method by using the sealant.

This photocuring resin composition for sealant contains (A) a compound having an oxetane ring, (B) a cationic photopolymerization initiator, and (C) a silane coupling agent, and has a viscosity of 0.01-300 Pa.s at 25°C. The sealant containing the photocuring resin composition is used for sealing the liquid crystal display, the electroluminescent display, or the like.

Inventors:

TAKAMATSU YASUSHI
NAGATA KATSURA
OTA MASAHIRO
MIZUTA YASUSHI
KIKUTA YOSHIO

Application Number:

JP2000249197A

Publication Date:

May 22, 2001

Filing Date:

August 11, 2000

Export Citation:

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Assignee:

MITSUI CHEMICALS INC

International Classes:

G02F1/1339; B05D7/00; B05D7/24; C08G65/18; C09K3/10; H05B33/04; (IPC1-7): C09K3/10; B05D7/00; C08G65/18; G02F1/1339; H05B33/04

Attorney, Agent or Firm:

Yanagihara

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